TOPIC> Physics Materials and Devices of Conventional Semiconductors

Investigation and Analysis of On-Chip ESD Protection Circuit under Electromagnetic Pulse

Xinyi Mao, Changchun Chai, Fuxing Li, Xin Zheng, Haodong Lin, Tianlong Zhao, and Yintang Yang

  • 1. Xidian University; 
  • 2. Xidian University; 
  • 3. Xidian University; 
  • 4. Xidian University; 
  • 5. Xidian University; 
  • 6. Xidian University; 
  • 7. Xidian University; 

Corresponding Author: Fuxing Li,

Abstract: The electrostatic discharge (ESD) protection circuit widely exists in the input and output ports of CMOS digital circuits, and electromagnetic pulse coupled into the device not only interacts with the CMOS circuit, but also acts on the protection circuit. This paper establishes on-chip electrostatic discharge protection circuit model, and draws the lattice temperature, current density and electric field intensity distribution from the multi-physical parameter model to explore the changes of the internal devices when the pulse comes. The results show that the ESD protection circuit has potential damage risk, and the injection of EMP leads to irreversible heat loss inside the circuit. In addition, pulse signals with different attributes will change the damage threshold of the circuit. These results provide an important reference for further evaluation of the influence of electromagnetic environment on the chip, which is helpful to carry out the reliability enhancement research of ESD protection circuit.

Key words: Damage effect; damage location prediction; electromagnetic pulse (EMP); on–chip ESD protection circuit

Cite as: JOSarXiv.202405.0001

Recommended references: Xinyi Mao, Changchun Chai, Fuxing Li, Xin Zheng, Haodong Lin, Tianlong Zhao, Yintang Yang . (2024). Investigation and Analysis of On-Chip ESD Protection Circuit under Electromagnetic Pulse. [JOSarXiv.202405.0001]   (Copy)

Version History

[V1] 2024-05-29 07:37:51 JOSarXiv.202405.0001V1Download

Article Metrics

Article views: 0 Times PDF downloads: 0 Times


Manuscript received: 29 May 2024

Manuscript published: 31 May 2024

Email This Article

User name: