Denghuai Tian1, 2, Hao Xu1, †, Jiahui Duan1, Yanrong Wang2, Jinjuan Xiang1, Xiaolei Wang1, Jing Zhang2
Corresponding Author: ${correspondingAuthorString}
Abstract: Hafnium-based ferroelectric devices show great potential in the application of high-efficiency memory technology. In this work, we study the effect of modulating deposition cycle ratio on memory windows and endurance of metal/ferroelectric/metal (MFM) capacitors. We fabricated capacitors with 3 conditions for Hf0.5Zr0.5O2 thin film of the deposition cycle ratio are 1:1, 5:5, 10:10, respectively. All samples have nearly the same memory window and the devices with a 10:10 cycle ratio could tolerate more bipolar cycles. By comparing the leakage and breakdown characteristics, the improved endurance for the 10:10 device is due to the lower trap density of oxygen vacancy. Furthermore, the deposition cycle ratio can be further optimized to make the trade-off between the performance and reliability in the ferroelectric devices.
Key words: CMOS technology; Hafnium-based ferroelectric; Endurance; Breakdown; Cycle ratio
Cite as: JOSarXiv.202201.0002
Version History
[V1] | 2022-01-16 08:26:39 | JOSarXiv.202201.0002V1 | Download |
Article views: 86 Times PDF downloads: 20 Times
Manuscript received: 16 January 2022
Manuscript published: 18 January 2022
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