Voltage level shifters are indispensable components in modern System on Chip (SoC) designs, where the continuous downscaling of CMOS technology has resulted in circuits operating across multiple supply domains. These circuits enable seamless communication between logic blocks powered at different voltage levels, ensuring functional correctness, energy efficiency, and reliable signal transfer. This work presents a broad review of level shifter architectures, outlining their operating principles, design evolution, and role in present day integrated systems. Major technical challenges, such as propagation delay, consumption of static and dynamic power, susceptibility to switching noise, and compatibility with ultra low power or dynamically scaled voltage systems, are discussed in depth. The survey analyzes a range of implementations, including static, dynamic, cross coupled PMOS, and current mirror based designs, and evaluates their performance trade offs in practical use cases. Special attention is given to innovations aimed at reducing delay, leakage, and silicon area, while improving applicability for subthreshold operation and adaptive voltage scaling. Differences between static and dynamic schemes are examined alongside emerging design approaches suited to next generation low power applications. By summarizing recent progress and ongoing limitations, this article serves as a comprehensive reference point for engineers and researchers seeking to develop efficient and robust voltage level shifting solutions.

Infrared and terahertz waves constitute pivotal bands within the electromagnetic spectrum, distinguished by their robust penetration capabilities and non−ionizing nature. These wavebands offer the potential for achieving high−resolution and non−destructive detection methodologies, thereby possessing considerable research significance across diverse domains including communication technologies, biomedical applications, and security screening systems. Two−dimensional materials, owing to their distinctive optoelectronic attributes, have found widespread application in photodetection endeavors. Nonetheless, their efficacy diminishes when tasked with detecting lower photon energies. Furthermore, as the landscape of device integration evolves, two−dimensional materials struggle to align with the stringent demands for device superior performance. Topological materials, with their topologically protected electronic states and non−trivial topological invariants, exhibit quantum anomalous Hall effects and ultra−high carrier mobility, providing a new approach for seeking photosensitive materials for infrared and terahertz photodetectors. This article introduces various types of topological materials and their properties, followed by an explanation of the detection mechanism and performance parameters of photodetectors. Finally, it summarizes the current research status of near−infrared to far−infrared photodetectors and terahertz photodetectors based on topological materials, discussing the challenges faced and future prospects in their development.

Interband cascade lasers (ICLs) are favorable mid-infrared light sources in the 3-4 m wavelength region. Herein, we demonstrate watt-level room temperature continuous wave (CW) emission from ICL arrays for the first time. A 16-μm-wide, 3-mm-long single ICL emitter with high/anti-reflection coatings exhibited a high continuous wave (CW) output power of 373 mW at 20℃, with a peak wall-plug efficiency (WPE) of 13.6%. The CW output power remained at 115 mW at 60℃. Furthermore, arrays with three and four emitters were fabricated to scale up the output powers. The distance between adjacent emitters was optimized to be 400 m to suppress the thermal crosstalk according to the thermal modeling of the arrays. The arrays were mounted epi-down on diamond submounts and measured in CW mode. The maximum room temperature CW output powers of the three- and four-emitter arrays reached 1 W and 1.2 W, with WPEs of 11.3% and 11.5% respectively. This demonstration paves a way for the realization of high-power light sources in the 3-4 m spectral range.

Infrared and terahertz waves constitute pivotal bands within the electromagnetic spectrum, distinguished by their robust penetration capabilities and non-ionizing nature. These wavebands offer the potential for achieving high-resolution and non-destructive detection methodologies, thereby possessing considerable research significance across diverse domains including communication technologies, biomedical applications, and security screening systems. Two-dimensional materials, owing to their distinctive optoelectronic attributes, have found widespread application in photodetection endeavors. Nonetheless, their efficacy diminishes when tasked with detecting lower photon energies. Furthermore, as the landscape of device integration evolves, two-dimensional materials struggle to align with the stringent demands for device superior performance.Topological materials, with their topologically protected electronic states and non-trivial topological invariants, exhibit quantum anomalous Hall effects and ultra-high carrier mobility, providing a new approach for seeking photosensitive materials for infrared and terahertz photodetectors. This article introduces various types of topological materials and their properties, followed by an explanation of the detection mechanism and performance parameters of photodetectors. Finally, it summarizes the current research status of near-infrared to far-infrared photodetectors and terahertz photodetectors based on topological materials, discussing the challenges faced and future prospects in their development.

In this paper, the principle of the plasma etching anisotropy of monocrystalline silicon along different crystal orientations is expounded. The process of creating deep holes in monocrystalline silicon and subsequently performing cross-cut etching to form a reaming zone is visually demonstrated through specific experimental design to meet the conditions. The relationship between crystal orientation, depth-to-width ratio, etching condition and etching anisotropy is analyzed in detail. Finally, the scenarios that can be applied by using this etching mechanism in the future are prospected.

The electrostatic discharge (ESD) protection circuit widely exists in the input and output ports of CMOS digital circuits, and electromagnetic pulse coupled into the device not only interacts with the CMOS circuit, but also acts on the protection circuit. This paper establishes on-chip electrostatic discharge protection circuit model, and draws the lattice temperature, current density and electric field intensity distribution from the multi-physical parameter model to explore the changes of the internal devices when the pulse comes. The results show that the ESD protection circuit has potential damage risk, and the injection of EMP leads to irreversible heat loss inside the circuit. In addition, pulse signals with different attributes will change the damage threshold of the circuit. These results provide an important reference for further evaluation of the influence of electromagnetic environment on the chip, which is helpful to carry out the reliability enhancement research of ESD protection circuit.

Brain-like information processing needs brain-like computing hardware. In recent decade, a range of brain-inspired analogue computing technologies has emerged. These technologies, such as in-memory computing with memristors, are expected to run machine learning tasks with high energy efficiency. It is widely recognized that these brain-inspired hardware gain efficiency through their non-von Neumann architecture, namely collocated processing and memory units. However, digital computing can also adopt non-von Neumann architecture to improve efficiency. Commercial analogue processors that can share the workloads of their digital counterparts are still beyond the horizon. Whether or not analogue computing can meet expectations remains uncertain. Here, we review the emergent analogue computing technologies, and interpret the rationale behind the advancements. Rather than emphasizing only the non-von Neumann architecture, we also stress the significance of space-time continuity in brain-like analogue systems. From a balanced perspective, we discuss the challenges and future directions for analogue computing.

High growth-rate synthesis is the characteristic feature of the horizontal gradient freezing technique by Bridgman for growth of single crystal such as InP, but the relevant growth is more exposed to Si contamination due the requirement of temperature higher than the melting point at the synthesize zone, therefore, the modified Bridgman methods HGF, and VGF that realizes by reducing the temperature of the growth region was developed which are the main topics discussed in this paper. Another improvement that presented is related by using pBN crucibles instead of using of quartz boat during the growth can degrading the Si contamination.

Nuclear batteries have attracted many attentions because of their long lifetime. Due to the large band gap and high radiation tolerance, diamond is an ideal material for the fabrication of the energy converter for nuclear batteries. In this work, a diamond Schottky barrier diode energy converter was prepared, and the performance of the device was studied by electron-beam induced current (EBIC) method. The energy converter can work under an electron beam irradiation with a beam current of μA order. The open-circuit voltage of the device is around 0.8 V, and a short-circuit current of several mA can be achieved. The maximum energy conversion efficiency of 3.19% is obtained under the beam current of 0.2 μA at 26 keV.

In this polishing experiment, the polishing effects of different crystal facets (Ga-face and N-face) of single-crystal gallium nitride (GaN) during the process of Photo-Catalyzed Chemical Mechanical Polishing (PACMP) were investigated by combining photocatalysis with chemical mechanical polishing (CMP). Furthermore, the influence mechanisms of polishing effects on different crystal facets were analyzed. Additionally, a comparison was made among three polishing methods: polishing without light, polishing with light polishing pad, and polishing with light polishing slurry. Various factors, such as TiO2 concentration, pH value, H2O2 concentration, polishing pressure, polishing pad rotational speed, and polishing slurry flow rate, were also studied to determine their impact on the polishing effects of GaN crystals on different facets. The process parameters were optimized accordingly.The experiments demonstrated that under the conditions of Photo-Catalyzed Chemical Mechanical Polishing with ultraviolet light assistance, the material removal rate (MRR) of Ga-face of GaN crystals can reach 698.864 nm/h, with a surface roughness (Ra) value of 0.430 nm and a root mean square height (Sq) of 0.842 nm. The MRR of N-face of GaN crystals can reach 619.435 nm/h, with an Ra value of 0.725 nm and an Sq of 1.162 nm. The composite polishing method of ultraviolet light-assisted CMP can achieve sub-nanometer-level super-smooth GaN crystal surfaces. Among them, the light polishing slurry method significantly improves the polishing efficiency and facilitates the rapid removal of Ga2O3 on the GaN surface.